Nagao, Shijo : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (128)
Les plus populaires
Liste
- Liste
- Tableau

1

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

Araki, Teppei, Sugahara, Tohru, Jiu, Jinting, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Uchida, Hiroshi, Shinozaki, Kenji, Suganuma, Katsuaki

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 2.26 MB

english, 2013

2

Thermostable Ag die-attach structure for high-temperature power devices

Zhang, Hao, Nagao, Shijo, Suganuma, Katsuaki, Albrecht, Hans-Juergen, Wilke, Klaus

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2016

Langue:

english

Fichier:

PDF, 4.91 MB

english, 2016

3

Pressureless Bonding Using Sputtered Ag Thin Films

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Année:

2014

Langue:

english

Fichier:

PDF, 1.39 MB

english, 2014

4

Silver stress migration bonding driven by thermomechanical stress with various substrates

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 1016 KB

english, 2015

5

Die-attaching silver paste based on a novel solvent for high-power semiconductor devices

Jiu, Jinting, Zhang, Hao, Nagao, Shijo, Sugahara, Tohru, Kagami, Noriko, Suzuki, Youji, Akai, Yasuyuki, Suganuma, Katsuaki

Journal:

Journal of Materials Science

Année:

2016

Langue:

english

Fichier:

PDF, 1.43 MB

english, 2016

6

Simultaneous synthesis of nano and micro-Ag particles and their application as a die-attachment material

Jiu, Jinting, Zhang, Hao, Koga, Shunsuke, Nagao, Shijo, Izumi, Yasuha, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2015

7

Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment

Park, Semin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 5.65 MB

english, 2015

8

[IEEE 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) - Sendai, Japan (2016.8.22-2016.8.25)] 2016 IEEE 16th International Conference on Nanotechnology (IEEE-NANO) - High thermal stability of SiC packaging with thermosetting imide-based nanocomposite encapsulating materials combined with sintered Ag paste die-attach

Sugioka, Takuo, Nagao, Shijo, Ogawa, Satoshi, Fujibayashi, Teruhisa, Sumida, Yasutaka, Hao, Zhang, Suganuma, Katsuaki

Année:

2016

Langue:

english

Fichier:

PDF, 310 KB

english, 2016

9

Development of thermal shock-resistant of GaN/DBC die-attached module by using Ag sinter paste and thermal stress relaxation structure

Kim, Dongjin, Chen, Chuantong, Suetake, Aiji, Choe, Chanyang, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Année:

2018

Langue:

english

Fichier:

PDF, 2.97 MB

english, 2018

10

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

Kim, Dongjin, Yamamoto, Yasuyuki, Nagao, Shijo, Wakasugi, Naoki, Chen, Chuantong, Suganuma, Katsuaki

Journal:

Année:

2019

Langue:

english

Fichier:

PDF, 5.20 MB

english, 2019

11

Thermal stress driven Sn whisker growth: in air and in vacuum

Jung-Lae Jo, Shijo Nagao, Tohru Sugahara…

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 1.23 MB

english, 2013

12

Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices

Soichi Sakamoto, Shijo Nagao…

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 866 KB

english, 2013

13

Mitigation of Sn Whisker Growth by Small Bi Additions

Jo, Jung-Lae, Nagao, Shijo, Hamasaki, Kyoko, Tsujimoto, Masanobu, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Année:

2014

Langue:

english

Fichier:

PDF, 1.69 MB

english, 2014

14

Retarding intermetallic compounds growth of Zn high-temperature solder and Cu substrate by trace element addition

Park, S. W., Nagao, Shijo, Sugahara, Tohru, Kim, Keun-Soo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 1.04 MB

english, 2013

15

Hillock growth dynamics for Ag stress migration bonding

Oh, Chulmin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Materials Letters

Année:

2014

Langue:

english

Fichier:

PDF, 1.59 MB

english, 2014

16

Carbon Nanotubes: Nanohinge-Induced Plasticity of Helical Carbon Nanotubes (Small 21/2013)

Wu, Jianyang, Nagao, Shijo, He, Jianying, Zhang, Zhiliang

Journal:

Année:

2013

Fichier:

PDF, 1.06 MB

2013

17

A highly sensitive and flexible pressure sensor with electrodes and elastomeric interlayer containing silver nanowires

Wang, Jun, Jiu, Jinting, Nogi, Masaya, Sugahara, Tohru, Nagao, Shijo, Koga, Hirotaka, He, Peng, Suganuma, Katsuaki

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 1.41 MB

english, 2015

18

‘Chrysanthemum petal’ arrangements of silver nano wires

Cui, Hui-Wang, Jiu, Jin-Ting, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 3.57 MB

english, 2014

19

Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current

Kim, Youngseok, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki, Ueshima, Minoru, Albrecht, Hans-Juergen, Wilke, Klaus, Strogies, Joerg

Journal:

Journal of Electronic Materials

Année:

2014

Langue:

english

Fichier:

PDF, 7.58 MB

english, 2014

20

Mechanical stabilities of ultrasonic Al ribbon bonding on electroless nickel immersion gold finished Cu substrates

Park, Semin, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Japanese Journal of Applied Physics

Année:

2014

Langue:

english

Fichier:

PDF, 1.03 MB

english, 2014

21

Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature

Kunimune, Teppei, Kuramoto, Masafumi, Ogawa, Satoru, Sugahara, Tohru, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Acta Materialia

Année:

2015

Langue:

english

Fichier:

PDF, 4.43 MB

english, 2015

22

Electromigration behavior in Cu/Ni–P/Sn–Cu based joint system with low current density

Kadoguchi, Takuya, Gotou, Keisuke, Yamanaka, Kimihiro, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Année:

2015

Langue:

english

Fichier:

PDF, 1.43 MB

english, 2015

23

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Diffusional hillock growth in Ag stress migration bonding for power device interconnections

Oh, Chulmin, Nagao, Shijo, Suganuma, Katsuaki

Année:

2015

Langue:

english

Fichier:

PDF, 1.48 MB

english, 2015

24

Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag

Zhang, Hao, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Année:

2015

Langue:

english

Fichier:

PDF, 2.42 MB

english, 2015

25

One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices

Ding, Su, Jiu, Jinting, Gao, Yue, Tian, Yanhong, Araki, Teppei, Sugahara, Tohru, Nagao, Shijo, Nogi, Masaya, Koga, Hirotaka, Suganuma, Katsuaki, Uchida, Hiroshi

Journal:

ACS Applied Materials & Interfaces

Année:

2016

Langue:

english

Fichier:

PDF, 4.42 MB

english, 2016

26

High-Temperature Die Attachment Using Sn-Plated Zn Solder for Power Electronics

Sungwon Park,, Nagao, Shijo, Kato, Yoshitaka, Ishino, Hiroshi, Sugiura, Kazuhiko, Tsuruta, Kazuhiro, Suganuma, Katsuaki

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2015

Langue:

english

Fichier:

PDF, 7.29 MB

english, 2015

27

Deformation and fracture of nano-sized metal-coated polymer particles: A molecular dynamics study

Wu, Jianyang, Nagao, Shijo, Zhang, Zhiliang, He, Jianying

Journal:

Engineering Fracture Mechanics

Année:

2015

Langue:

english

Fichier:

PDF, 2.79 MB

english, 2015

28

[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - A novel mechanism of silver microflakes sinter joining

Zhang, Hao, Nagao, Shijo, Lin, Shih-kang, Yokoi, Emi, Chen, Chuantong, Suganuma, Katsuaki

Année:

2016

Langue:

english

Fichier:

PDF, 1.97 MB

english, 2016

29

Mechanical and Optical Properties Characterization of C-Plane (0001) and M-Plane (10−10) GaN by Nanoindentation and Luminescence

Yokogawa, Toshiya, Fujikane, Masaki, Nagao, Shijo, Nowak, Roman

Journal:

MRS Proceedings

Année:

2015

Langue:

english

Fichier:

PDF, 20.20 MB

english, 2015

30

Contact Resistance and Metallurgical Connections Between Silver Coated Polymer Particles in Isotropic Conductive Adhesives

Pettersen, Sigurd R., Kristiansen, Helge, Nagao, Shijo, Helland, Susanne, Njagi, John, Suganuma, Katsuaki, Zhang, Zhiliang, He, Jianying

Journal:

Journal of Electronic Materials

Année:

2016

Langue:

english

Fichier:

PDF, 1.51 MB

english, 2016

31

Self-reducible copper ink composed of copper-amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

Li, Wanli, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Chemistry C

Année:

2016

Langue:

english

Fichier:

PDF, 2.81 MB

english, 2016

32

Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices

Zhang, Hao, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Année:

2017

Langue:

english

Fichier:

PDF, 3.03 MB

english, 2017

33

Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Jiu, Jinting, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Journal:

Journal of Electronic Materials

Année:

2017

Langue:

english

Fichier:

PDF, 3.16 MB

english, 2017

34

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection

Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Année:

2016

Langue:

english

Fichier:

PDF, 2.13 MB

english, 2016

35

Molecular dynamics study of deformation and fracture in SiC with angular dependent potential model

Kubo, Atsushi, Nagao, Shijo, Umeno, Yoshitaka

Journal:

Computational Materials Science

Année:

2017

Langue:

english

Fichier:

PDF, 2.08 MB

english, 2017

36

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Effect of pre-annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag

Chen, Chuantong, Zhang, Zheng, Nagao, Shijo, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Année:

2018

Langue:

english

Fichier:

PDF, 4.10 MB

english, 2018

37

Reliability analysis of sintered Cu joints for SiC power devices under thermal shock condition

Gao, Yue, Takata, Shuhei, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Bahman, Amir Sajjad, Iannuzzo, Francesco

Journal:

Microelectronics Reliability

Année:

2019

Langue:

english

Fichier:

PDF, 1.70 MB

english, 2019

38

Strengthening of DBA substrate with Ni/Ti/Ag metallization for thermal fatigue-resistant Ag sinter joining in GaN power modules

Kim, Dongjin, Chen, Chuantong, Lee, Seung-Joon, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2020

Langue:

english

Fichier:

PDF, 3.61 MB

english, 2020

39

Precision of nanoindentation protocols for measurement of viscoelasticity in cortical and trabecular bone

Hanna Isaksson, Shijo Nagao, Marta MaŁkiewicz, Petro Julkunen, Roman Nowak, Jukka S. Jurvelin

Journal:

Journal of Biomechanics

Année:

2010

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2010

40

Cationic photopolymerization of liquid fullerene derivative under visible light

Kalle Lintinen, Alexander Efimov, Sami Hietala, Shijo Nagao, Pasi Jalkanen, Nikolai Tkachenko, Helge Lemmetyinen

Journal:

Journal of Polymer Science Part A: Polymer Chemistry

Année:

2008

Langue:

english

Fichier:

PDF, 190 KB

english, 2008

41

Mechanical properties characterization of c -plane (0001) and m -plane (10–10) GaN by nanoindentation examination

Masaki Fujikane, Akira Inoue, Toshiya Yokogawa, Shijo Nagao, Roman Nowak

Journal:

physica status solidi (c)

Année:

2010

Langue:

english

Fichier:

PDF, 399 KB

english, 2010

42

Yield shear stress dependence on nanoindentation strain rate in bulk GaN crystal

Masaki Fujikane, Toshiya Yokogawa, Shijo Nagao, Roman Nowak

Journal:

physica status solidi (c)

Année:

2011

Langue:

english

Fichier:

PDF, 161 KB

english, 2011

43

An electric current spike linked to nanoscale plasticity

Berg, Michael, Tukiainen, Antti, Pessa, Markus, Nowak, Roman, Chrobak, Dariusz, Nagao, Shijo, Vodnick, David

Journal:

Nature Nanotechnology

Année:

2009

Langue:

english

Fichier:

PDF, 528 KB

english, 2009

44

Nanoindentation examination of yttria-stabilized zirconia (YSZ) crystal

Masaki Fujikane, Daigo Setoyama, Shijo Nagao, Roman Nowak, Shinsuke Yamanaka

Journal:

Journal of Alloys and Compounds

Année:

2007

Langue:

english

Fichier:

PDF, 588 KB

english, 2007

45

Elastic–plastic transition during nanoindentation in bulk GaN crystal

Masaki Fujikane, Michał Leszczyński, Shijo Nagao, Tadachika Nakayama, Shinsuke Yamanaka, Koichi Niihara, Roman Nowak

Journal:

Journal of Alloys and Compounds

Année:

2008

Langue:

english

Fichier:

PDF, 536 KB

english, 2008

46

Nanoindentation study on insight of plasticity related to dislocation density and crystal orientation in GaN

Fujikane, Masaki, Yokogawa, Toshiya, Nagao, Shijo, Nowak, Roman

Journal:

Applied Physics Letters

Année:

2012

Langue:

english

Fichier:

PDF, 2.08 MB

english, 2012

47

Nanohinge-Induced Plasticity of Helical Carbon Nanotubes

Wu, Jianyang, Nagao, Shijo, He, Jianying, Zhang, Zhiliang

Journal:

Année:

2013

Langue:

english

Fichier:

PDF, 2.52 MB

english, 2013

48

Giant Stretchability and Reversibility of Tightly Wound Helical Carbon Nanotubes

Wu, Jianyang, He, Jianying, Odegard, Gregory M., Nagao, Shijo, Zheng, Quanshui, Zhang, Zhiliang

Journal:

Journal of the American Chemical Society

Année:

2013

Langue:

english

Fichier:

PDF, 4.34 MB

english, 2013

49

Strain Rate Controlled Nanoindentation Examination and Incipient Plasticity in Bulk GaN Crystal

Fujikane, Masaki, Yokogawa, Toshiya, Nagao, Shijo, Nowak, Roman

Journal:

Japanese Journal of Applied Physics

Année:

2013

Langue:

english

Fichier:

PDF, 768 KB

english, 2013

50

Low haze transparent electrodes and highly conducting air dried films with ultra-long silver nanowires synthesized by one-step polyol method

Araki, Teppei, Jiu, Jinting, Nogi, Masaya, Koga, Hirotaka, Nagao, Shijo, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Année:

2014

Langue:

english

Fichier:

PDF, 1.00 MB

english, 2014